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In the circuit design, the heat generated by the inductance coil plays an important role in the circuit. The heat generated will cause the temperature of the inductive coil to rise. The temperature has a great impact on the inductive coil. The resistance of the coil generally increases with the temperature. How can we reduce the impact of the heat generated by the inductive coil on the coil? Now please see the summary of this article.

The following methods are commonly used to reduce the impact of thermal conduction of inductance coil on the circuit.

1. Each electronic component in each circuit has a thermal impedance, and the value of the thermal impedance can reflect the heat transfer capacity of the medium or between the mediums. The size of thermal impedance varies with materials, external area, use and installation position. The use of thermal impedance electronic components with high thermal conductivity is the most traditional and effective way to reduce the heat conduction of inductance coils.

2.For the heat dissipation by circuit, the cooling fan is the most widely used in the market at present. By changing the hot air around the inductance coil, forced convection cold air is used to replace the hot air, and the heat of the circuit is continuously transmitted to the surrounding air. Generally speaking, the cooling fan can effectively enhance the heat dissipation capacity by 30%, but the disadvantage is that it will generate vibration and noise. It is only applicable to traditional or modern equipment such as computers, automobile accessories, frequency converters, hardware tools, refrigeration equipment, etc. with large volume.

3.The heat dissipation coating is directly applied to the surface of the object (inductance coil) to be cooled, and the heat absorbed will radiate and dissipate to the outer space while the heat is accumulated and heated. It can also increase self-cleaning, insulating, anti-corrosion, moisture-proof and other properties. It is a new way to reduce the impact of thermal conduction of inductance coil on the circuit.

4.The thermal conductivity and hot melt of liquid are larger than those of gas, so liquid cooling is better than fan cooling. The coolant directly and indirectly contacts the power induction coil or other electronic components to radiate heat and bring the heat out of the circuit. The disadvantages are high cost, large volume and weight, and difficult maintenance.

5.Heat conductive adhesive and heat dissipation paste have the same function as the literal meaning. They have excellent heat conductivity and can effectively improve the heat dissipation capacity of electronic components in the circuit. They are often used to smear on the surface of electronic components (inductive coils) to transmit heat to the radiator (radiator is made of copper or aluminum). The radiator absorbs the heat and radiates it to the outside of the circuit, keeping the temperature of the circuit normal. Secondly, the heat dissipation paste has certain moisture-proof, dust-proof, anti-corrosion and other functions, and is an effective means to improve the heat dissipation capacity and stability of electronic components.